Non-destructive testing with radiography and CT offers outstanding possibilities for electronics and semi-conductors.
The xray-lab has a great experience in analyzing a variety of electronical devices, e.g.: lead frames, circuit boards, surface-mount devices (SMD), column grid arrays (CGAs) or ball grid arrays (BGAs). Latter are analyzed with automated and semi-automated software for pores and for the correct position and form of the connections.
Furthermore, the xray-lab offers different methods to analyze solder connections and integrated circuits quickly and efficiently.
Testing cables and cable connections non-destructively, that are otherwise inaccessible, is one of our specialties as well. 2D radiography gives fast results without damaging or mechanically loading the analyzed goods.