Non-destructive testing with radiography and CT offers outstanding possibilities for electronics and semi-conductors.
XRAY-LAB has a great experience in analyzing a variety of electronical devices including lead frames, circuit boards, surface-mount devices (SMD), column grid arrays (CGAs) or ball grid arrays (BGAs). Semi-automated software are later analyzed for pores, corrected position and the form of the connections.
Furthermore, XRAY-LAB offers different methods to analyze solder connections and integrated circuits quickly and efficiently.
We also have the capability of testing cable and cable connections that are usually inaccessible. 2D radiography gives fast results without damaging or mechanically loading the analyzed goods.